KEY DATES
Call for Papers
8 September, 2026
Digest Submission
8 September, 2026
Author Notification
13 September, 2026
In-situ Registration
September 18-20, 2026
CONFERENCE INTRODUCTION
This symposium centers on the international cutting-edge research in the field of flexible electronics and advanced materials, with the objective of establishing a high-caliber platform for academic communication and industry-academia-research collaboration between China and countries including Saudi Arabia, Serbia, Singapore, Slovakia, Slovenia, South Africa, the Republic of Korea, Spain, Sweden and Switzerland.Centered around pivotal research directions such as novel materials, flexible devices, embodied intelligence, wearable electronics, brain-computer interfaces, printed electronics, intelligent manufacturing technologies and future-oriented industries, the event convenes worldwide experts, academics and industrial pioneers to exchange state-of-the-art research findings, explore technological evolution trends, advance cross-national collaborative innovation and technology transfer, foster the high-quality and sustainable advancement of the flexible electronics and advanced materials domain, and expedite the commercialization of future industries in advanced materials and flexible electronics to deliver public welfare.
INVITED SPEAKERS
Feng Gao
Linköping University, Sweden
Michael Grätzel
École Polytechnique Fédérale de Lausanne (EPFL),Switzerland
LIU Xiaogang
National University of Singapore, Singapore
Yong-Young Noh
Pohang University of Science and Technology,South Korea
Stefaan De Wolf
King Abdullah University of Science and Technology (KAUST), Saudi Arabia
Daniel Jaque García
Universidad Autonoma de Madrid,Spain
Ferry Prins
Universidad Autonoma de Madrid,Spain
Pablo Ares
Universidad Autonoma de Madrid,Spain
Han Young Woo
Korea University,South Korea
Tönu Pullerits
Lund University, Sweden
Wai-yeung Wong, Raymond
The Hong Kong Polytechnic University, Hong Kong, China
Yuttapoom Puttisong
Linköping University, Sweden
Tien-Chien Jen
University of Johannesburg, South Africa
Sum Tze Chien
Nanyang Technological University, Singapore
Wolfgang Tress
Zurich University of Applied Sciences
Jesus Martinez de la Fuente
University of Zaragoza, Spain
Jianpu Wang
Nantong University, China
Qiang Zhao
Nanjing University of Information Science and Technology / Nanjing University of Posts and Telecommunications, China
Yizheng Jin
Zhejiang University, China
Yonghua Chen
Nanjing Tech University, China
Haifeng Ling
Nanjing University of Posts and Telecommunications, China
Heyong Wang
Italian Institute of Technology, Italy
Haidong Yu
Northwestern Polytechnical University, China
Weidong Xu
Northwestern Polytechnical University, China
Songcan Wang
Northwestern Polytechnical University, China
Weiwei Zhao
Nanjing University of Posts and Telecommunications, China
Yueying Yang
Northwestern Polytechnical University, China
Ye Tao
Nanjing University of Posts and Telecommunications, China
Hongjian Zhang
Henan University / Henan Institute of Flexible Electronics, China
Xun Xiao
Peking University, China
Yuqing Huang
Institute of Semiconductors, Chinese Academy of Sciences, China
Qingzhen Bian
Ocean University of China, China
Changshun Chen
Northwestern Polytechnical University, China
Jun Yin
The Hong Kong Polytechnic University, Hong Kong, China
Yong Wang
Zhejiang University, China
Chuan Liu
Sun Yat-sen University, China
ORGANIZERS
Organizers
Northwestern Polytechnical University
Hosted by
School of Flexible Electronics, Northwestern Polytechnical University
Flexible Electronics Branch, Chinese Institute of Electronics
NEWS CENTER
